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Introduction To Nickel Silicide

wallpapers Environment 2020-12-04
Some metals (such as lithium, calcium, magnesium, iron, chromium, etc.) and certain non-metals (such as boron, etc.) and silicon form binary compounds. It is generally crystal, with metallic luster, hard and high melting point.
One kind of metal or non-metal can generate many kinds of silicides. Such as iron can produce FeSi, FeSi2, Fe2Si5, Fe3Si2, Fe5Si3 and so on. It can be obtained by reducing metal (or non-metal) oxide or metal silicate with silicon in an electric furnace.
Metal silicides are widely used for their excellent high-temperature oxidation resistance, electrical conductivity and heat transfer.

Nickel silicide NiSi: For semiconductor manufacturing processes at technology nodes of 45 nanometers and below, nickel silicide (NiSi) is becoming the material of choice for contact applications. Compared with the previous titanium cobalt silicide, nickel silicide has a series of unique advantages. Nickel silicide still uses the two-step annealing process similar to the previous silicide, but the annealing temperature has been significantly reduced (<600oC), which greatly reduces the damage to the ultra-shallow junction formed in the device.
From the perspective of diffusion kinetics, a shorter annealing time can effectively inhibit ion diffusion. Therefore, spike anneal is increasingly used for the first annealing process of nickel silicide. The annealing only has a heating and cooling process without a heat preservation process, so it can greatly limit the diffusion of doped ions during the formation of silicide.

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